Tantalum Metal Powder for Sputtering Targets from Japan
Ultra-fine tantalum powder (particle size 1-10 microns) designed for plasma spraying and sputtering target production in semiconductor manufacturing. Classified under HTS 8103.20.00.90 as unwrought tantalum powder, not sintered or wrought into articles. It remains in raw powder form suitable for further processing.
Duty Rate — Japan → United States
2.5%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide supplier's lot analysis confirming no sintering; customs may inspect for processing evidence
• Use nitrogen-purged containers to prevent ignition; comply with DOT hazardous material shipping rules
• Label with CAS number (7440-25-7) and UN proper shipping name for accurate entry summary