Molybdenum Lighting Filament Scrap
Broken filament mandrels and support wire scrap from halogen lamp manufacturing. Fine wire scrap classified HTS 8102.97.00.00, purity 99.95% Mo. Recovered from lamp assembly rejects.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
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Import Tips & Compliance
• Tungsten separation critical; mixed wires reclassify
• Coil diameter specs distinguish scrap from wire
• Static-free handling prevents filament damage claims
Related Products under HTS 8102.97.00.00
Molybdenum Turning Scrap
Scrap generated from machining molybdenum rods and bars, consisting of fine metal turnings and chips with high molybdenum content. Classified under HTS 8102.97.00.00 as waste and scrap of molybdenum, distinct from unwrought or semi-manufactured forms. Purity typically exceeds 99% molybdenum by weight.
Molybdenum Machining Swarf
Wet or dry swarf from CNC machining of molybdenum components, primarily metal fines and coolant-contaminated particles. Falls under HTS 8102.97.00.00 as molybdenum scrap unfit for direct reuse without processing. Excludes any finished articles or bars.
Molybdenum Electrode Scrap
Discarded ends and trimmings from molybdenum electrodes used in glass melting furnaces. This waste material is classified as molybdenum scrap under HTS 8102.97.00.00 due to its metallurgical grade and recycling suitability. Typically 99.9% pure molybdenum.
Molybdenum Wire Crop Ends Scrap
Short crop ends and rejects from molybdenum wire drawing operations, collected as scrap for remelting. HTS 8102.97.00.00 applies to this clean, high-purity waste (98-99.5% Mo). Not suitable as finished wire products.
Molybdenum Furnace Lining Scrap
Scrap recovered from worn molybdenum furnace linings in high-temperature applications like sapphire crystal growth. Classified under HTS 8102.97.00.00 as molybdenum-containing waste, post-oxidation removal. Requires chemical recovery for reuse.
Molybdenum Sputtering Target Scrap
Used molybdenum targets from semiconductor thin-film deposition processes, machined to remove used surfaces. This high-purity scrap (99.99% Mo) falls under HTS 8102.97.00.00 for recycling into new targets. Cleaned but not remelted.