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Nickel Flex Circuit Foil 0.04 mm from Japan

Ultra-thin 0.04 mm pure nickel foil laminated substrate for flexible printed circuits in wearables. Classified HTS 7506.10.05.00 for non-alloyed nickel foil thickness. Enables bendable electronics with corrosion resistance.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Base metal layer classification before polyimide lamination applied

Distinguish substrate foil from etched circuit (8534) by completion stage

RoHS compliance documentation for electronics imports