Nickel Flex Circuit Foil 0.04 mm from Japan
Ultra-thin 0.04 mm pure nickel foil laminated substrate for flexible printed circuits in wearables. Classified HTS 7506.10.05.00 for non-alloyed nickel foil thickness. Enables bendable electronics with corrosion resistance.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Base metal layer classification before polyimide lamination applied
• Distinguish substrate foil from etched circuit (8534) by completion stage
• RoHS compliance documentation for electronics imports