Nickel Flex Circuit Foil 0.04 mm
Ultra-thin 0.04 mm pure nickel foil laminated substrate for flexible printed circuits in wearables. Classified HTS 7506.10.05.00 for non-alloyed nickel foil thickness. Enables bendable electronics with corrosion resistance.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If polyimide-dominant laminate
Flex circuit substrates often classify by plastic carrier material.
If printed circuitry complete
Finished printed circuits recognized regardless of substrate.
If copper circuit layer dominant
Copper-clad laminates typically classify under copper foil.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Base metal layer classification before polyimide lamination applied
• Distinguish substrate foil from etched circuit (8534) by completion stage
• RoHS compliance documentation for electronics imports
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