Single-Sided Copper Clad Phenolic Laminate from Japan
Phenolic paper substrate with single-sided refined copper foil ≤0.15mm cladding for low-cost consumer electronics PCBs. Economical backed laminate option. HTS 7410.21.3060 applies.
Duty Rate — Japan → United States
53%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Phenolic resin content declaration to distinguish from FR grades
• Moisture protection critical for phenolic materials