Polyimide Copper Clad Laminate for Flex PCBs from Mexico
Flexible copper clad laminate using polyimide film backed with refined copper foil ≤0.15mm thick, designed for flexible printed circuits. The copper provides conductive layers on the polymer backing. Classified under HTS 7410.21.3060 as other backed copper clad laminates of refined copper.
Duty Rate — Mexico → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Confirm polyimide as the backing material and copper purity as refined; retain supplier certificates for alloy content
• Declare exact thickness measurement method excluding backing to prevent disputes over 0.15mm limit
• Avoid common error of classifying as finished flex PCB; specify as raw clad material only