CEM-1 Copper Clad Laminate Panels from Japan
Cost-effective CEM-1 composite epoxy material clad with refined copper foil on one or both sides, foil thickness not exceeding 0.15mm. Ideal for single/double-sided PCB prototypes. HTS 7410.21.3060 applies to these other backed copper clad laminates of refined copper.
Duty Rate — Japan → United States
53%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide PCB industry standard specs (IPC-4101) confirming CEM-1 composition and copper cladding
• Watch for peeling/backing separation during shipping; use proper packaging to maintain integrity for customs inspection