BT Resin Copper Clad Laminate for IC Substrates from Canada
Bismaleimide-triazine (BT) resin laminate clad with ultra-thin refined copper foil ≤0.15mm for semiconductor packaging substrates. High-density interconnect ready. HTS 7410.21.3060.
Duty Rate — Canada → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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