BT Resin Copper Clad Laminate for IC Substrates from Canada
Bismaleimide-triazine (BT) resin laminate clad with ultra-thin refined copper foil ≤0.15mm for semiconductor packaging substrates. High-density interconnect ready. HTS 7410.21.3060.
Duty Rate — Canada → United States
53%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
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