PCB Solder Mask Developer Solution from Japan
Alkaline chemical mixture to develop exposed solder mask on printed circuit boards after UV exposure. Falls under HTS 3824.99.70.00 as materials for printed circuit boards. Creates precise protective coating pattern over circuitry.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Classify as UN 3266 corrosive liquid; sodium carbonate/potassium hydroxide content
• Developer strength specification prevents reclassification as general cleaner
• Rinse water treatment requirements for wastewater compliance