Mixtures of dibromo neopentyl glycol; Polydibromophenylene oxide; Tetrabromobisphenol-A-carbonate oligomers; and Electroplating chemical and electroless plating solutions and other materials for printed circuit boards, plastics and metal finishings
Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: > Other: > Other: > Other: > Other: > Other: > Mixtures of dibromo neopentyl glycol; Polydibromophenylene oxide; Tetrabromobisphenol-A-carbonate oligomers; and Electroplating chemical and electroless plating solutions and other materials for printed circuit boards, plastics and metal finishings
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 3824.99.70.00
Polydibromophenylene Oxide Flame Retardant
A polymeric brominated flame retardant derived from polydibromophenylene oxide used in high-performance plastics and electronics housings. Classified under HTS 3824.99.70.00 due to explicit inclusion of polydibromophenylene oxide mixtures. Provides thermal stability and fire resistance in engineering thermoplastics.
Palladium PCB Etch Resist Remover
Specialized chemical mixture using palladium catalyst to remove etch resist from printed circuit boards during manufacturing. Classifies under HTS 3824.99.70.00 as materials for printed circuit boards. Enables precise circuit patterning without substrate damage.
Immersion Gold Plating Solution
Chemical bath for displacement plating thin gold layer onto nickel-plated PCB pads for soldering reliability. HTS 3824.99.70.00 covers such electroplating materials for printed circuit boards. Ensures wire bondability and corrosion protection.
PCB Solder Mask Developer Solution
Alkaline chemical mixture to develop exposed solder mask on printed circuit boards after UV exposure. Falls under HTS 3824.99.70.00 as materials for printed circuit boards. Creates precise protective coating pattern over circuitry.
Plastic Chrome Plating Accelerator
Palladium-based activator solution for etching and sensitizing plastic surfaces prior to electroless plating. HTS 3824.99.70.00 includes such materials for plastics finishing. Enables adhesion of metal plating to ABS and other plastic substrates.
Electroless Copper PCB Seed Layer Solution
Formaldehyde-reduced copper solution for creating conductive seed layer on non-conductive PCB substrates. Specifically covered under HTS 3824.99.70.00 as electroless plating for printed circuit boards. Essential first metallization step in PCB fabrication.
Dibromo Neopentyl Glycol Flame Retardant Mixture
A brominated chemical mixture based on dibromo neopentyl glycol used as a reactive flame retardant in polyurethane foams and resins. It falls under HTS 3824.99.70.00 as a specified mixture of dibromo neopentyl glycol for industrial applications in plastics and coatings. This subheading covers such brominated compounds not elsewhere specified.
Tetrabromobisphenol-A-Carbonate Oligomer
Oligomeric flame retardant based on tetrabromobisphenol-A-carbonate used in polycarbonate resins for electrical components. Explicitly covered under HTS 3824.99.70.00 as specified carbonate oligomers. Offers high bromine content for flame retardancy without migration.
Acid Copper Electroplating Solution
Electrolyte solution containing copper sulfate and sulfuric acid for electroplating copper onto printed circuit boards. Falls under HTS 3824.99.70.00 as specified electroplating chemicals for PCBs. Enables uniform copper deposition in electronics manufacturing.
Electroless Nickel Plating Bath
Chemical solution for autocatalytic nickel deposition on plastics and circuit boards without electricity. Covered by HTS 3824.99.70.00 as electroless plating solutions for printed circuit boards and plastics. Provides uniform corrosion-resistant nickel layer.