Immersion Gold Plating Solution from Mexico
Chemical bath for displacement plating thin gold layer onto nickel-plated PCB pads for soldering reliability. HTS 3824.99.70.00 covers such electroplating materials for printed circuit boards. Ensures wire bondability and corrosion protection.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Gold content declaration mandatory; affects both tariff and precious metals reporting
• pH stability critical - improper shipping causes gold precipitation
• Distinguish from electrolytic gold solutions which may classify differently