Immersion Gold Plating Solution from Japan
Chemical bath for displacement plating thin gold layer onto nickel-plated PCB pads for soldering reliability. HTS 3824.99.70.00 covers such electroplating materials for printed circuit boards. Ensures wire bondability and corrosion protection.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Gold content declaration mandatory; affects both tariff and precious metals reporting
• pH stability critical - improper shipping causes gold precipitation
• Distinguish from electrolytic gold solutions which may classify differently