Electroless Nickel Plating Bath from Japan
Chemical solution for autocatalytic nickel deposition on plastics and circuit boards without electricity. Covered by HTS 3824.99.70.00 as electroless plating solutions for printed circuit boards and plastics. Provides uniform corrosion-resistant nickel layer.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Declare as corrosive liquid UN 3264; temperature control critical during transport
• Provide activator, reducer, and nickel source concentration specifications