Electroless Nickel Plating Bath from Japan
Chemical solution for autocatalytic nickel deposition on plastics and circuit boards without electricity. Covered by HTS 3824.99.70.00 as electroless plating solutions for printed circuit boards and plastics. Provides uniform corrosion-resistant nickel layer.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare as corrosive liquid UN 3264; temperature control critical during transport
• Provide activator, reducer, and nickel source concentration specifications