Electroless Copper PCB Seed Layer Solution from Canada
Formaldehyde-reduced copper solution for creating conductive seed layer on non-conductive PCB substrates. Specifically covered under HTS 3824.99.70.00 as electroless plating for printed circuit boards. Essential first metallization step in PCB fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Formaldehyde concentration triggers OSHA and EPA reporting requirements
• Bath life and reducer stability critical for import quality control
• Distinguish from electroplating copper which uses different chemistry