Silicon Ingot for Power Semiconductor Slicing from China
Monocrystalline silicon ingot produced by Czochralski process, over 2.5 grams, for high-voltage power diode wafer production. Classified HTS 3824.99.1100 as cultured crystal ingot (non-optical) in Chapter 38 preparations. High-purity n/p-type doped silicon essential for IGBT and thyristor manufacturing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Document resistivity (e.g
• 1-10 ohm-cm) and crystal orientation (<100>/<111>) to confirm semiconductor-grade status
• Avoid Chapter 28 silicon classification by including CZ growth process certification