Silicon Wafer Bow and Warp Metrology Tool from United States
A capacitive and optical instrument that measures wafer bow, warp, and flatness, which are critical for lithography alignment in IC fabrication, supporting 300mm wafers. It ensures wafer geometry meets specifications for semiconductor production. This equipment falls under tariff item 9030.82.00 as it measures or checks semiconductor wafers.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the tool under 9030.82.00 and provide technical specifications showing its use for wafer checking
• If the tool includes both capacitive and optical sensors, ensure they are integral to the measurement function
• Verify if the equipment qualifies for duty relief under the Machinery and Equipment Program