Parts
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Duty Rate (from China)
Products classified under Tariff item 8543.90.00.00
E-Beam Crucible for PVD Evaporation
A high-temperature ceramic or metal crucible used to hold evaporant materials in electron beam physical vapor deposition (PVD) sources. It is designed specifically for use in PVD apparatus of subheading 8543.70 and withstands extreme heat during evaporation processes.
8543.90.00Magnetron Sputtering Cathode Assembly
An assembly containing permanent magnets, cooling channels, and mounting fixtures for holding sputtering targets in PVD systems. It is essential for generating the plasma discharge in physical vapor deposition apparatus under subheading 8543.70.
8543.90.00PVD Anode Shield for Arc Suppression
A conductive shield that prevents arcing in unbalanced magnetron PVD sources by stabilizing plasma. It is part of the electrical systems in physical vapor deposition apparatus under subheading 8543.70 and enhances reliability in industrial coating lines.
8543.90.00PVD Cryogenic Pump Mounting Flange
A precision-machined flange connecting cryogenic pumps to PVD vacuum chambers for ultra-high vacuum maintenance. It is specifically designed for physical vapor deposition apparatus of subheading 8543.70, ensuring contamination-free deposition.
8543.90.00PVD Ion Source Grid Assembly
A multi-aperture grid that accelerates ions in ion-assisted PVD deposition sources for enhanced film adhesion. It is integral to physical vapor deposition apparatus under subheading 8543.70 and improves coating density in advanced manufacturing.
8543.90.00PVD Load Lock Door Assembly
A gate valve and viewport assembly for transferring substrates into PVD chambers without breaking vacuum. It is designed for physical vapor deposition apparatus in subheading 8543.70, maintaining process integrity in high-throughput systems.
8543.90.00PVD Mass Flow Controller Mount
A specialized bracket and feedthrough for mounting gas flow controllers on PVD process manifolds. It is designed for apparatus of subheading 8543.70, ensuring precise reactive gas delivery for controlled atmosphere deposition.
8543.90.00PVD Planetary Substrate Holder
A rotating fixture holding multiple substrates for uniform coating in large-area PVD systems. It is motor-driven for apparatus under subheading 8543.70 and used in solar cell and display manufacturing for even film thickness.
8543.90.00PVD Plasma Cleaning Head
An RF-powered electrode assembly for pre-deposition substrate cleaning in PVD chambers. It is part of physical vapor deposition apparatus in subheading 8543.70, removing contaminants via reactive plasma to enhance adhesion.
8543.90.00PVD Quartz Crystal Monitor Sensor
A sensor using quartz crystal microbalance to measure film thickness in real-time during PVD processes. It is mounted inside deposition chambers of 8543.70 apparatus for precise process control and quality assurance.
8543.90.00PVD Substrate Heater Element
A resistively heated platform that maintains substrate temperatures up to 800°C during PVD film deposition. It is designed for integration into physical vapor deposition apparatus of subheading 8543.70, essential for controlling film properties.
8543.90.00PVD Target Shutter Mechanism
A pneumatically or motor-driven shutter blocking the line-of-sight from sputtering target to substrate in PVD systems. It is used in multi-layer deposition sequences within 8543.70 apparatus to prevent unwanted deposition.
8543.90.00PVD Vacuum Chamber Baffle
A contoured metal shield installed inside PVD deposition chambers to control plasma distribution and prevent cross-contamination. It is made from materials like stainless steel or molybdenum for high-vacuum compatibility in PVD systems.
8543.90.00RF Power Matching Network for PVD
An electronic module that automatically tunes RF power delivery to sputtering sources in PVD systems for optimal plasma ignition. It is integral to the electrical control of physical vapor deposition apparatus in subheading 8543.70.
8543.90.00Titanium Sputtering Target for PVD Systems
A high-purity titanium disc used as the source material in physical vapor deposition (PVD) apparatus for depositing thin titanium films on substrates. It is specifically designed for magnetron sputtering modules within PVD systems.