Wafer Level Chip Scale Package (WLCSP) Redistribution Layer from Japan
A thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. This substrate is a specialized component for wafer level chip scale packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, enabling advanced fan-out packaging.
Duty Rate — Japan → Canada
0%
Import Tips
• Provide technical documentation showing the redistribution layer's structure and function in WLCSP
• Classify the product as a part of ICs, not as a printed circuit
• Ensure the substrate is not declared as a complete IC package, which would fall under heading 85.42