Wafer Level Chip Scale Package (WLCSP) Redistribution Layer from Germany
A thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. This substrate enables fan-out packaging by redistributing electrical connections. It is classified under tariff item 8542.90.00 as a specialized part of electronic integrated circuits.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Provide the redistribution layer's dielectric and metal layer specifications, including line widths and spacing
• If the layer is part of a complete WLCSP package, it may be classified as a complete IC
• Ensure the product is not classified as a printed circuit board of heading 85.34