Gold Wire Bonding Wedge Tool from Japan
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a specialized part of the wire bonding process, essential for assembling electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices, not as a general hand tool.
Duty Rate — Japan → Canada
0%
Import Tips
• Provide evidence that the wedge tool is specifically designed for IC wire bonding, not for general use
• Include technical drawings showing the tool's geometry and material
• Ensure the product is not classified as an interchangeable tool of Chapter 82, which would be incorrect