Gold Wire Bonding Wedge Tool from Japan
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a critical consumable in the wire bonding process, shaping the wire and transmitting ultrasonic energy. It is classified under tariff item 8542.90.00 as a specialized part for electronic integrated circuit assembly.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the wedge tool as a part of IC manufacturing equipment, not as a hand tool
• Provide the tool's specifications, such as tip geometry and material, to support the classification
• If the tool is used with a specific wire bonder, reference the machine model in the documentation