Static read-write random access memory (SRAM)
Electronic integrated circuits. > Electronic integrated circuits: > Memories > Static read-write random access memory (SRAM)
Duty Rate (from China)
Products classified under Tariff item 8542.32.00.30
128Mb EDO DRAM
An Extended Data Out (EDO) DRAM chip with a maximum capacity of 128 megabits, used in legacy PC motherboards. It is a dynamic read-write memory, fitting the description of memories under this tariff item.
8542.32.0016Mb DRAM Chip
A 16 megabit Dynamic Random Access Memory (DRAM) integrated circuit used in early consumer electronics like digital cameras and portable audio players. Its capacity is below 128 megabits, fitting the memory classification.
8542.32.0032Mb SDRAM Chip
A Synchronous Dynamic Random Access Memory (SDRAM) chip with 32 megabit capacity, used in graphics cards and early workstations. Despite its synchronous interface, it is a dynamic read-write memory under 128 megabits.
8542.32.004Mx4 16Mb DRAM SIP
A 16 megabit Single In-line Package (SIP) DRAM organized as 4 million words by 4 bits, used in embedded systems. Its dynamic RAM function and capacity under 128 megabits determine classification.
8542.32.00512Mb Buffer DRAM for SSD Controllers
This is a 512 megabit DRAM used as volatile cache buffer in solid state drive controllers for wear leveling and data mapping. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity range.
8542.32.00512Mb DRAM for Digital Set-Top Boxes
This is a 512 megabit synchronous DRAM chip for digital television set-top boxes and media players, handling video decoding and channel buffering. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00512Mb DRAM for Networking Routers
This is a high-speed 512 megabit synchronous DRAM optimized for packet buffering in enterprise routers and switches. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity range.
8542.32.00512Mb Graphics DRAM for FPGA Development
This is a 512 megabit high-speed DRAM interface chip for FPGA prototyping boards and graphics acceleration development kits. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00512Mbit DRAM for Smart Meters
This is a low-power 512 megabit DRAM for utility smart electricity meters, storing billing data and load profiles. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity range.
8542.32.00512 Megabit SDRAM Chip for Printers KM416S4030CT-G8
This is a Single Data Rate Synchronous DRAM integrated circuit with 512 megabit capacity, optimized for laser printer and multifunction device buffer memory. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.0064Mb Mobile DRAM IC
A 64 megabit DRAM chip optimized for mobile phones and PDAs from the late 1990s. Its dynamic read-write random access functionality and capacity under 128 megabits place it under this tariff item.
8542.32.008Mb Video RAM DRAM
An 8 megabit DRAM configured as Video RAM (VRAM) for graphics adapters in 1990s computers. Its core DRAM technology and capacity under 128 megabits determine classification.
8542.32.00Alliance Memory AS4C256M16D3-12BCN 256Mb DDR3L DRAM
A 256 megabit low-voltage DDR3L DRAM chip used as a replacement for legacy systems and IoT devices. Its capacity falls in the 128-256 megabit range, fitting the memory classification.
8542.32.00ATP Industrial 32GB Industrial SLC NAND Flash IC
A ruggedized single-level cell NAND flash memory integrated circuit designed for industrial applications requiring high endurance and extended temperature ranges. It is a memory IC, falling under the memories subheading of electronic integrated circuits.
8542.32.00DDR3L 512Mbit Automotive Grade DRAM AS4C256M16D3L-60BCN
This is an automotive-qualified DDR3L DRAM chip with 512 megabit capacity, designed for extended temperature range (-40°C to 105°C) and high reliability in vehicle electronics. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00Flight Recorder 512Mbit DRAM Chip
This is a ruggedized 512 megabit DRAM with radiation tolerance for avionics black box flight data recorders and cockpit display systems. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00Gaming Console 512Mbit DRAM Chip
This is a 512 megabit DDR memory IC specifically engineered for handheld gaming consoles and portable gaming systems. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00Hynix H5TQ2G43BFR-H9 256Mb Mobile DDR DRAM Chip
A low-power 256 megabit mobile DDR DRAM integrated circuit optimized for smartphones and tablets. It qualifies as a dynamic read-write random access memory in the 128-256 megabit range.
8542.32.00Industrial 512Mb DRAM Chip for PLC Systems
This is a ruggedized 512 megabit dynamic RAM IC designed for programmable logic controllers and industrial automation equipment, featuring wide temperature operation and error correction. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.
8542.32.00Intel 64GB Optane 3D XPoint Memory IC
A non-volatile memory integrated circuit using 3D XPoint technology, offering persistent storage with speeds approaching DRAM. It is a specialized memory IC, classified under the memories subheading.
8542.32.00ISSI IS42S16160G-6BLI 256Mb SDRAM Automotive Grade
An automotive-qualified 256 megabit SDRAM IC with extended temperature operation (-40°C to 85°C). It meets the criteria for dynamic read-write memories in the 128-256 megabit range.
8542.32.00Kingston EMMC 64GB NAND Flash Memory Chip
An embedded MultiMediaCard (eMMC) using 3D NAND flash technology for non-volatile storage in mobile devices. This is a memory IC before module assembly, falling under the memories subheading.
8542.32.00Kioxia BG4 512Gb 3D TLC NAND for Automotive
An automotive-grade 3D TLC NAND flash IC qualified to AEC-Q100 for high reliability in infotainment and ADAS systems. It is a memory IC, classified under the memories subheading.
8542.32.00Microchip 24AA02E48 2Kb EEPROM Serial Memory IC
A serial EEPROM memory IC with I2C interface, used for configuration storage in embedded systems. It is a non-volatile memory, falling under the memories subheading.
8542.32.00Micron MT40A512M16HA-083E 8GB DDR4 SDRAM IC
A high-performance DDR4 synchronous DRAM integrated circuit used for temporary data storage in computers and data centers. It is a volatile memory IC, classified under the memories subheading.
8542.32.00Micron MT46H64M32BFCM-6 2Gb DDR2 DRAM IC (256Mx8)
A 256 megabit DDR2 SDRAM chip used in consumer electronics and networking equipment. Its capacity is between 128 and 256 megabits, fitting the memory classification.
8542.32.00Nanya NT5CB256M16DP-DI 256Mb DDR3L Industrial DRAM
An industrial-grade 256 megabit DDR3L SDRAM for servers and networking gear. It is classified as a dynamic read-write memory in the 128-256 megabit range, with ECC support for error correction.
8542.32.00PC-98 64Mb DRAM Module Chip
A 64 megabit DRAM specifically designed for NEC PC-98 computers popular in Japan. It is a standard dynamic read-write memory under the capacity limit, fitting this tariff item.
8542.32.00Qualcomm MSM8998 SOC with Embedded LPDDR4x Memory
A system-on-chip (SOC) integrating a central processing unit with embedded LPDDR4x memory, designed for flagship smartphones. While it performs multiple functions, its memory component is significant, and it is classified as a memory integrated circuit under this tariff item.
8542.32.00Renesas R1LV0804ASP-7SI 8Mb SRAM IC
An ultra-low power static RAM integrated circuit for battery-backed applications in meters and controllers. It is a memory IC, falling under the memories subheading.
8542.32.00Renesas R1MP161664APG-80 256Mbit SDRAM Chip
A 256 megabit synchronous DRAM (SDRAM) IC with 80ns access time for industrial control systems. Its capacity over 128 but not over 256 megabits determines classification.
8542.32.00Samsung K4B2G1646G-BCK0 256Mb DDR3 DRAM Chip
This is a 256 megabit DDR3 synchronous dynamic random access memory (DRAM) integrated circuit designed for high-performance computing applications. It is classified under tariff item 8542.32.00 as a memory, which falls under electronic integrated circuits.
8542.32.00Samsung K4B2G1646G-BCK0 8Gb DDR3L SDRAM Chip
A monolithic DDR3L SDRAM memory chip used for high-speed data access in computers and servers. It is a dynamic random access memory IC, classified under the memories subheading.
8542.32.00Samsung KLUCG2K1ED-B2C1 256GB UFS 2.1 Flash Memory IC
A Universal Flash Storage 2.1 IC providing high-speed non-volatile memory for premium smartphones and tablets. It is an advanced memory integrated circuit, falling under the memories subheading.
8542.32.00SanDisk SDAPMUW-512G 512GB NVMe SSD Controller Memory IC
A PCIe NVMe controller IC with integrated DRAM cache and NAND interface, used in enterprise solid-state drives. Its primary function is memory management, making it classifiable as a memory integrated circuit.
8542.32.00SK Hynix H9HCNNNBDMMMR 16Gb LPDDR4X DRAM Chip
A low-power DDR4X synchronous DRAM IC optimized for mobile devices and automotive applications. It is a volatile memory IC, classified under the memories subheading.
8542.32.00Toshiba THGAMRG8T13BAIL 128GB eMMC 5.1 NAND IC
An eMMC 5.1 controller-integrated NAND flash memory for IoT devices and wearables, offering high sequential read speeds. It is a memory IC, falling under the memories subheading.
8542.32.00Western Digital 128GB 3D TLC NAND Flash IC
A triple-level cell 3D NAND flash memory die for high-capacity non-volatile storage in SSDs and embedded systems. It is a memory-specific electronic integrated circuit, classified under the memories subheading.
8542.32.00Winbond W29GL512CL 512Mbit NOR Flash Memory IC
A parallel NOR flash memory IC used for code execution in microcontrollers and set-top boxes. It is a non-volatile memory, falling under the memories subheading.
8542.32.00Winbond W9825G6JH-6 256Mb Low Cost SDRAM Chip
This is a cost-optimized 256 megabit SDRAM chip for consumer printers and set-top boxes, featuring a 6ns access time. It is classified under tariff item 8542.32.00 as a memory, being a dynamic random access memory within the specified capacity.