Memories
Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals. > Other semiconductor devices: > Memories
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8542.32
128Mb EDO DRAM
An Extended Data Out (EDO) DRAM chip at maximum 128 megabit capacity for legacy PC motherboards. It falls under tariff item 8542.32.00 as a dynamic read-write memory not exceeding 128 megabits.
8542.32.0016Mb DRAM Chip
A single 16 megabit Dynamic Random Access Memory (DRAM) integrated circuit used in early consumer electronics like digital cameras and portable audio players. It is classified under tariff item 8542.32.00 as a dynamic read-write memory.
8542.32.00ATP Industrial 32GB Industrial SLC NAND Flash IC
An industrial-grade single-level cell (SLC) NAND flash memory integrated circuit designed for extreme temperature and endurance in industrial applications. It falls under tariff item 8542.32.00 as a memory integrated circuit, specifically a non-volatile flash memory device.
8542.32.00Intel 64GB Optane 3D XPoint Memory IC
A next-generation non-volatile memory integrated circuit using 3D XPoint technology for persistent storage with DRAM-like speeds in enterprise servers. It is classified under tariff item 8542.32.00 as a memory device, specifically a non-volatile memory IC.
8542.32.00Kingston EMMC 64GB NAND Flash Memory Chip
An embedded MultiMediaCard (eMMC) using 3D NAND flash technology for non-volatile storage in smartphones and tablets. It falls under tariff item 8542.32.00 as a memory integrated circuit before module assembly.
8542.32.00Kioxia BG4 512Gb 3D TLC NAND for Automotive
An automotive-grade 3D TLC NAND flash IC for infotainment and ADAS systems requiring high reliability. It is classified under tariff item 8542.32.00 as a memory integrated circuit, specifically a non-volatile flash memory device.
8542.32.00Microchip 24AA02E48 2Kb EEPROM Serial Memory IC
An I2C serial electrically erasable programmable read-only memory (EEPROM) IC for configuration storage in embedded systems. It falls under tariff item 8542.32.00 as a memory integrated circuit, specifically a non-volatile EEPROM device.
8542.32.00Micron MT40A512M16HA-083E 8GB DDR4 SDRAM IC
A high-performance DDR4 synchronous dynamic random access memory (SDRAM) integrated circuit used in laptops and data centers for temporary data storage. It is classified under tariff item 8542.32.00 as a memory IC, specifically a volatile DRAM device.
8542.32.00Renesas R1LV0804ASP-7SI 8Mb SRAM IC
An ultra-low power static RAM (SRAM) integrated circuit for battery-backed applications in meters and controllers. It falls under tariff item 8542.32.00 as a memory IC, specifically a volatile SRAM device.
8542.32.00Samsung K4B2G1646G-BCK0 8Gb DDR3L SDRAM Chip
A monolithic electronic integrated circuit memory chip using DDR3L SDRAM technology for high-speed data access in computers and servers. It falls under tariff item 8542.32.00 as it is specifically classified as a memory device.
8542.32.00Samsung KLUCG2K1ED-B2C1 256GB UFS 2.1 Flash Memory IC
A Universal Flash Storage (UFS) 2.1 IC providing high-speed non-volatile memory for premium smartphones and tablets. It falls under tariff item 8542.32.00 as an advanced memory integrated circuit.
8542.32.00SK Hynix H9HCNNNBDMMMR 16Gb LPDDR4X DRAM Chip
A low-power DDR4X synchronous DRAM IC optimized for mobile devices and automotive applications requiring efficient volatile memory. It is classified under tariff item 8542.32.00 for memory integrated circuits.
8542.32.00Toshiba THGAMRG8T13BAIL 128GB eMMC 5.1 NAND IC
An eMMC 5.1 controller-integrated NAND flash memory for IoT devices and wearables offering sequential read speeds over 250MB/s. It falls under tariff item 8542.32.00 as a memory IC.
8542.32.00Western Digital 128GB 3D TLC NAND Flash IC
A triple-level cell (TLC) 3D NAND flash memory die for high-capacity non-volatile storage in SSDs and embedded systems. It is classified under tariff item 8542.32.00 as a memory-specific electronic integrated circuit.
8542.32.00Winbond W29GL512CL 512Mbit NOR Flash Memory IC
A parallel NOR flash memory IC for code execution in microcontrollers and set-top boxes. It falls under tariff item 8542.32.00 as a NOR-type non-volatile memory device.