Wafer Slicing Diamond Saw from Japan
A wafer slicing diamond saw that cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the saw is described as solely or principally for wafer slicing in your import documents
• Provide technical specifications showing the blade type and slicing precision to the CBSA
• Confirm whether the diamond blade is classified separately as a part under 8486.90.00