Silicon Wafer Polishing Machine from Germany
A silicon wafer polishing machine that uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Duty Rate — Germany → Canada
0%
Import Tips
• Classify the polishing machine under 8486.10.00 by demonstrating its exclusive use in wafer polishing through technical specifications
• Be prepared to explain the CMP process to the CBSA if asked
• Verify whether the polishing slurry is classified separately under another heading