Precision Wafer Slicer from United States
A precision wafer slicer that uses inner-diameter diamond saws for kerfless wafering from semiconductor boules, minimizing waste for thin wafers. It is designed for high-precision slicing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the slicer is described as solely or principally for wafer slicing in your import documents
• Provide a detailed description of the inner-diameter saw mechanism to the CBSA
• Verify whether the slicer qualifies for duty relief under the Machinery Program if applicable