Multi-Wire Wafer Slicing Saw from Mexico
A multi-wire wafer slicing saw that uses diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. It is used for high-volume silicon wafer production. This machine is essential for wafer manufacture and is classified under this tariff item.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the saw under 8486.10.00 by providing evidence that it is designed exclusively for slicing semiconductor boules
• Include technical specifications showing the wire array and slicing precision in your customs declaration
• Confirm whether the diamond wire is classified separately as a part under 8486.90.00