Double-Sided Wafer Grinder from Mexico
A double-sided wafer grinder that processes both faces of a semiconductor wafer simultaneously to achieve parallel thickness control, essential for device uniformity. It uses planetary motion with diamond pads for precision grinding. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Duty Rate — Mexico → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the grinder under 8486.10.00 by demonstrating its exclusive use in wafer manufacturing through technical specifications
• Be ready to explain the grinding process to the CBSA if asked
• Verify whether the grinder's diamond pads are classified separately as parts under 8486.90.00