Chemical Mechanical Wafer Polisher from China
A chemical mechanical wafer polisher that uses a slurry and polishing pad to planarize semiconductor wafers, achieving sub-micron flatness required for advanced lithography. It includes in-situ endpoint detection to control the polishing process precisely. This machine is used solely or principally for wafer manufacture, making it classifiable under this tariff item.
Duty Rate — China → Canada
0%
Import Tips
• Classify the polisher under 8486.10.00 by providing evidence that it is designed exclusively for wafer polishing, such as technical datasheets
• Confirm whether the polisher includes any parts or accessories that may be separately classified under 8486.90.00
• Consult the CBSA's D-Memoranda for guidance on machinery classification to avoid delays