Thin Film Glass Substrate Embossing Mold from Japan
A nanoprecision embossing mold for microstructuring thin glass substrates used in displays and sensors. This mold falls under tariff item 8480.50.00 as a mould for glass, excluding semiconductor wafer processing equipment per statistical notes.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the mold is not classified under heading 84.86 for semiconductor manufacturing, as this would change duty rates
• Provide detailed specifications showing the mold's use for glass substrates, not electronic components
• Verify that the mold's precision features are accurately declared for valuation