Thin Film Glass Substrate Embossing Mold
A nanoprecision embossing mold for microstructuring thin glass substrates used in displays and sensors. This mold falls under tariff item 8480.50.00 as a mould for glass, excluding semiconductor wafer processing equipment per statistical notes.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the mold is used in semiconductor device manufacturing
8486.20.00 covers machines for manufacturing semiconductor devices, which may apply if the mold is part of such processes.
If the mold is for mineral materials other than glass
8480.60.00 covers moulds for mineral materials, which may be relevant if the mold is used for similar materials.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the mold is not classified under heading 84.86 for semiconductor manufacturing, as this would change duty rates
• Provide detailed specifications showing the mold's use for glass substrates, not electronic components
• Verify that the mold's precision features are accurately declared for valuation
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