Semiconductor Wafer Lapper
> A semiconductor wafer lapper uses loose abrasives to achieve initial flatness on semiconductor wafers before polishing. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If used for semiconductor wafer fabrication
Machines for manufacturing semiconductor devices are classified under heading 84.86.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• > Verify the lapper is used for semiconductor wafers; if so, it falls under heading 84.86
• Ensure compliance with Canadian safety standards
Related Products under Tariff item 8479.30.00
Automated Wafer Polishing Line
> An automated wafer polishing line integrates sequential wafer loading, lapping, polishing, and cleaning processes into a single system. It is designed for preparing semiconductor wafers by mechanical and chemical-mechanical means, which falls under machinery for treating wood or cork only if the wood or ligneous materials are the primary substrate. However, since the candidate is for semiconductor wafers, it does not fall under this tariff item.
Chemical Mechanical Planarization Tool
> A chemical mechanical planarization (CMP) tool uses a chemical slurry and a mechanical polishing pad to planarize semiconductor wafers. While it is preparatory equipment, it is not machinery for treating wood or cork, so it does not fall under this tariff item.
Crystal Boule Grinder
> A crystal boule grinder shapes semiconductor boules to precise diameters and grinds flats to indicate conductivity type. This equipment is used for semiconductor material preparation, not for treating wood or cork, so it is excluded from this tariff item.
Crystal boule Grinder with Flats
> A crystal boule grinder with flats grinds precise flats on semiconductor boules to indicate crystal orientation and doping type. This is specialized semiconductor processing equipment and does not fall under machinery for treating wood or cork.
Czochralski Crystal Puller
> A Czochralski crystal puller grows monocrystalline silicon boules from molten silicon for semiconductor wafer production. This is semiconductor manufacturing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
Double-Sided Wafer Polisher
> A double-sided wafer polisher simultaneously polishes both surfaces of semiconductor wafers to achieve a mirror finish and precise thickness variation. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.