Presses for the manufacture of particle board or fibre building board of wood or other ligneous materials and other machinery for treating wood or cork
Vacuum cleaners. > With self-contained electric motor: > Parts > Of the goods of tariff item No. 8479.89.41 or 8479.89.49: > Other > Presses for the manufacture of particle board or fibre building board of wood or other ligneous materials and other machinery for treating wood or cork
Duty Rate (from China)
Products classified under Tariff item 8479.30.00.00
Automated Wafer Polishing Line
> An automated wafer polishing line integrates sequential wafer loading, lapping, polishing, and cleaning processes into a single system. It is designed for preparing semiconductor wafers by mechanical and chemical-mechanical means, which falls under machinery for treating wood or cork only if the wood or ligneous materials are the primary substrate. However, since the candidate is for semiconductor wafers, it does not fall under this tariff item.
8479.30.00Chemical Mechanical Planarization Tool
> A chemical mechanical planarization (CMP) tool uses a chemical slurry and a mechanical polishing pad to planarize semiconductor wafers. While it is preparatory equipment, it is not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00Crystal Boule Grinder
> A crystal boule grinder shapes semiconductor boules to precise diameters and grinds flats to indicate conductivity type. This equipment is used for semiconductor material preparation, not for treating wood or cork, so it is excluded from this tariff item.
8479.30.00Crystal boule Grinder with Flats
> A crystal boule grinder with flats grinds precise flats on semiconductor boules to indicate crystal orientation and doping type. This is specialized semiconductor processing equipment and does not fall under machinery for treating wood or cork.
8479.30.00Czochralski Crystal Puller
> A Czochralski crystal puller grows monocrystalline silicon boules from molten silicon for semiconductor wafer production. This is semiconductor manufacturing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00Double-Sided Wafer Polisher
> A double-sided wafer polisher simultaneously polishes both surfaces of semiconductor wafers to achieve a mirror finish and precise thickness variation. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.
8479.30.00Float Zone Crystal Grower
> A float zone crystal grower produces high-purity monocrystalline silicon by zone melting, avoiding crucible contamination. This is semiconductor manufacturing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00Gallium Arsenide Wafer Slicer
> A gallium arsenide wafer slicer uses specialized saws to slice brittle gallium arsenide wafers from compound semiconductor boules. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.
8479.30.00Sapphire Wafer Preparation Grinder
> A sapphire wafer preparation grinder grinds synthetic sapphire boules for LED/HB-LED wafer production. This is semiconductor or LED manufacturing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00Semiconductor Wafer Lapper
> A semiconductor wafer lapper uses loose abrasives to achieve initial flatness on semiconductor wafers before polishing. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.
8479.30.00Silicon Ingot Grinder
> A silicon ingot grinder shapes silicon ingots to exact diameters with orientation flats for wafer slicing. This is semiconductor material preparation equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00SOI Wafer Bond Strength Tester
> An SOI wafer bond strength tester tests bonded wafer strength after preparatory processing. This is testing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.
8479.30.00Wafer Edge Profiling Machine
> A wafer edge profiling machine profiles wafer edges to prevent chipping and enable handling during fabrication. This is semiconductor processing equipment, not machinery for treating wood or cork, so it is excluded from this tariff item.
8479.30.00Wafer Slicing Diamond Saw
> A wafer slicing diamond saw slices thin wafers from monocrystalline semiconductor boules with minimal kerf loss. This is semiconductor processing equipment, not machinery for treating wood or cork, so it does not fall under this tariff item.