Semiconductor Wafer Edge Grinder
An edge grinding machine that chamfers and shapes wafer peripheries to prevent chipping during handling. It grinds semiconductor wafers as solid mineral products, improving wafer strength and handling in fabrication.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine uses abrasive wheels for edge grinding
Machine-tools for grinding with abrasive wheels are classified in heading 84.60.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the machine is not classified as a machine-tool for working materials by grinding, which falls under heading 84.60
• Provide a clear description of the edge-grinding process to CBSA
• Check if the grinder qualifies for duty-free treatment under the Information Technology Agreement
Related Products under Tariff item 8474.20.00
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