Sylatronix STX 220 Wafer Dicing Saw from United States
The Sylatronix STX 220 Wafer Dicing Saw is a numerically controlled gang saw for simultaneous cutting-off of multiple semiconductor wafer lanes. It is designed for high-volume cermet material removal in device singulation. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the primary feature.
Duty Rate — United States → Canada
0%
Import Tips
• Document the gang saw configuration to show it is a sawing machine for cutting-off cermets
• Confirm with CBSA whether the numerical control qualifies for item 8461.50.10
• Ensure the semiconductor wafer materials are clearly specified for classification