Semiconductor Wafer Slicing Saw
A high-precision diamond wire saw for slicing ultra-thin wafers from monocrystalline silicon boules in semiconductor fabrication. This machine removes material through a cutting-off process to produce wafers of precise thickness. It is classified here as a sawing machine specifically for cutting-off semiconductor materials, not elsewhere specified.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is solely or principally used for the manufacture of semiconductor devices
Heading 84.86 covers semiconductor manufacturing equipment.
If the machine is numerically controlled
Numerically controlled sawing machines are classified under this alternative.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide evidence of the machine's sawing function and its use in semiconductor fabrication
• Verify if the machine qualifies for any duty relief programs
• Have technical specifications ready to support your classification
Related Products under Tariff item 8461.50.90
Crystal Boule Grinder
A machine tool that grinds semiconductor crystal boules to precise diameters and flats that indicate conductivity type, an essential step in wafer preparation. This machine removes material from the boule to achieve the required dimensions. It is classified under this item as a machine-tool working by removing metal or cermets, not elsewhere specified.
Czochralski Crystal Puller
A machine tool used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon using the Czochralski method. While it removes excess material through precise cutting, its primary function is crystal growth, not material removal. It is classified here as a machine-tool working by removing metal or cermets, not elsewhere specified.
Diamond Wire Wafer Slicer
An advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. This machine works by cutting-off material from the boule to produce thin wafers. It is classified here as a sawing or cutting-off machine working by removing metal or cermets, not elsewhere specified.
Float Zone Crystal Grower
A specialized sawing and cutting machine that employs the float zone method to produce high-purity silicon crystals for wafers, involving precise zone melting and cutting-off operations. This machine removes material through cutting to shape the crystal. It is classified here as a machine-tool working by removing metal or cermets, not elsewhere specified.
Gallium Arsenide Wafer Saw
A specialized inner-diameter saw optimized for brittle gallium arsenide compound semiconductor wafers, minimizing subsurface damage during cutting. This machine works by sawing through the material to produce wafers. It is classified here as a sawing machine working by removing metal or cermets, not elsewhere specified.
NC Crystal Boule Grinder
A numerically controlled grinding machine that shapes silicon crystal boules to precise diameters and grinds orientation flats that indicate conductivity type. This machine works by removing material from the boule, a critical step in semiconductor wafer preparation. It falls under this tariff item as a machine-tool working by removing metal or cermets, not elsewhere specified.