Loadpoint Micro ACE Stealth Dicing Machine from Japan
The Loadpoint Micro ACE Stealth Dicing Machine is an ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. It removes material via internal fracture but is structured as a numerically controlled sawing machine. This falls under 8461.50.90 as a sawing machine for cutting-off cermets, despite the laser technology.
Duty Rate — Japan → Canada
0%
Import Tips
• Confirm with CBSA that the stealth dicing process is classified as sawing, not laser cutting, which may fall under different headings
• Provide technical documentation on the material removal mechanism
• Verify if the machine is numerically controlled, which could affect classification