Diamond Wire Wafer Slicer from Germany
An advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. This machine works by cutting-off material from the boule to produce thin wafers. It is classified here as a sawing or cutting-off machine working by removing metal or cermets, not elsewhere specified.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Describe the sawing function clearly in your import documentation
• Verify if the machine is used solely for semiconductor manufacturing, which may affect classification
• Check for any special permits required for advanced manufacturing equipment