Rebuilt Disco DFG8360 Wafer Grinder from China
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. It is classified under 8460.40.10 as a numerically controlled grinding machine for metal or cermets, given its use on semiconductor materials.
Duty Rate — China → Canada
0%
Import Tips
• For rebuilt machinery, provide documentation of the refurbishment process and the original manufacturer's specifications
• Verify that the numerical control system is fully functional and declared
• Check if the machine qualifies for duty relief under the Machinery Remission Program for used or rebuilt equipment