Rebuilt Disco DFG8360 Wafer Grinder
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. It is classified under 8460.40.10 as a numerically controlled grinding machine for metal or cermets, given its use on semiconductor materials.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is not numerically controlled
Non-CNC grinding machines fall under the other subheading.
If the machine is used for semiconductor materials like silicon
Machines for working mineral materials may be classified under this heading.
If the machine is used for grinding only
Grinding machines without lapping or honing function may be classified elsewhere.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• For rebuilt machinery, provide documentation of the refurbishment process and the original manufacturer's specifications
• Verify that the numerical control system is fully functional and declared
• Check if the machine qualifies for duty relief under the Machinery Remission Program for used or rebuilt equipment
Related Products under Tariff item 8460.40.10
Engis Hyprez CNC Lapping System
The Engis Hyprez CNC Lapping System is a numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Its programmable lapping cycles and abrasive process make it a clear fit for tariff item 8460.40.10.
Haas CNC Lapping Machine TL-1
The Haas CNC Lapping Machine TL-1 is a numerically controlled precision lapping system designed for finishing flat surfaces on metal parts and cermets using abrasive slurries. It operates under programmable control to achieve consistent surface quality and dimensional accuracy, fitting the definition of a numerically controlled lapping machine under tariff item 8460.40.10.
Kemet CNC Lapping-Polishing Centre 48
The Kemet CNC Lapping-Polishing Centre 48 is a numerically controlled flat lapping and polishing centre for semiconductor wafers, automotive components, and precision optics. Its 3-axis CNC control and automatic slurry dispensing align with tariff item 8460.40.10 for numerically controlled lapping machines.
Lambatape LSF 6000 CNC Lapping Center
The Lambatape LSF 6000 CNC Lapping Center is a numerically controlled lapping machine for high-volume production finishing of automotive and aerospace metal parts using diamond abrasives. Its programmable control system and abrasive-based finishing process align with the scope of tariff item 8460.40.10 for numerically controlled lapping machines.
Logitech PM5 CNC Precision Lapping Machine
The Logitech PM5 CNC Precision Lapping Machine is a CNC-controlled precision lapping system for semiconductor materials, geological samples, and metal surfaces requiring optical flatness. Its automated lapping plate conditioning and sample loading, along with numerical control, place it under tariff item 8460.40.10.
Okamoto ACC-1224DXL CNC Lapping System
The Okamoto ACC-1224DXL CNC Lapping System is a numerically controlled double-sided lapping machine for achieving mirror finishes on metal and cermet workpieces. It uses abrasive processes under CNC control, making it a clear fit for tariff item 8460.40.10, which covers numerically controlled honing or lapping machines.