UV Laser PCB Via Drilling System from Mexico
The UV Laser PCB Via Drilling System is a high-precision UV laser system that drills micro-vias in multilayer printed circuit boards for HDI applications. It is used principally for printed circuit manufacturing through photon beam processes, classifying it under 8456.11.00.
Duty Rate — Mexico → Canada
0%
Import Tips
• Classify the via drilling system under 8456.11.00, specifying the UV laser's wavelength and power
• If the machine is used for semiconductor wafer via drilling, heading 8486 may apply
• Ensure the machine complies with Canadian laser safety standards and include relevant certifications in the import documentation