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UV Laser PCB Via Drilling System

The UV Laser PCB Via Drilling System is a high-precision UV laser system that drills micro-vias in multilayer printed circuit boards for HDI applications. It is used principally for printed circuit manufacturing through photon beam processes, classifying it under 8456.11.00.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFreeβ€”Free
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡ΊπŸ‡ΈUnited StatesFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.20.00Same rate: Free

If the machine is used for semiconductor wafer processing

Machines for semiconductor manufacturing are classified under heading 8486.

8456.90.00Same rate: Free

If the machine is used for other drilling processes

Other laser drilling machines fall under this heading.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Classify the via drilling system under 8456.11.00, specifying the UV laser's wavelength and power

β€’ If the machine is used for semiconductor wafer via drilling, heading 8486 may apply

β€’ Ensure the machine complies with Canadian laser safety standards and include relevant certifications in the import documentation

Related Products under Tariff item 8456.11.00

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The Amada FOL-3015AJ is a pulsed fiber laser cutting system engineered for precise cutting of thin to medium gauge metals, including galvanized steel and titanium alloys. It operates by directing a high-energy laser beam to melt and vaporize material, classifying it under tariff item 8456.11.00 for laser-operated machine-tools.

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The Amada FOL3015AJ Pulsed Fiber Laser System is designed for precision cutting of thin sheets and non-metals like plastics using short photon bursts for minimal heat-affected zones. It is classified under 8456.11.00 as a laser-operated machine-tool, though the 'other' subheading may apply if it is not specifically for metal cutting.

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The Bystronic ByStar Fiber 3015 is a high-power fiber laser cutting system designed for processing stainless steel, aluminum, and mild steel sheets at speeds up to 150 m/min. It uses a focused photon beam to remove material, fitting the definition of a laser-operated machine-tool under 8456.11.00.