Wafer Polishing Pad for CMP Machines from United States
A polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror-finish surface flatness before device fabrication. It is classified under this tariff item as a part of finishing machinery for textile fabrics, per the statistical notes for wafer preparation equipment.
Duty Rate — United States → Canada
0%
Import Tips
• Declare the polishing pad as a part of CMP machinery under 8451.90.90, not as an abrasive article of Chapter 68
• Provide a technical datasheet to the CBSA to confirm the pad's use in semiconductor wafer polishing
• Check if the MFN duty rate or a preferential rate under a trade agreement applies