Wafer Polishing Pad for CMP Machines
A polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror-finish surface flatness before device fabrication. It is classified under this tariff item as a part of finishing machinery for textile fabrics, per the statistical notes for wafer preparation equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the pad is made of agglomerated abrasives
Abrasive articles of agglomerated abrasives are classified in Chapter 68, excluded from Chapter 84.
If the CMP machine is a standalone machine with a specific function
Machines with a specific function not covered elsewhere in Chapter 84 are classified in heading 84.79.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Declare the polishing pad as a part of CMP machinery under 8451.90.90, not as an abrasive article of Chapter 68
• Provide a technical datasheet to the CBSA to confirm the pad's use in semiconductor wafer polishing
• Check if the MFN duty rate or a preferential rate under a trade agreement applies
Related Products under Tariff item 8451.90.90
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