Wafer Backside Grinder Diamond Wheel from Japan
A specialized diamond grinding wheel for thinning semiconductor wafers from 775μm to 50-100μm for advanced packaging applications. It is a part of wafer grinding equipment, classified under this tariff item as parts of machinery for finishing textile fabrics, per the statistical notes for semiconductor wafer preparation.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the wheel is classified as a part of wafer grinding machinery, not as a tool of Chapter 82
• Provide a statement of use to the CBSA to confirm the wheel is for semiconductor wafer thinning
• Check if the MFN duty rate or a preferential rate under a trade agreement applies