Wafer Backside Grinder Diamond Wheel
A specialized diamond grinding wheel for thinning semiconductor wafers from 775μm to 50-100μm for advanced packaging applications. It is a part of wafer grinding equipment, classified under this tariff item as parts of machinery for finishing textile fabrics, per the statistical notes for semiconductor wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the wheel is an interchangeable tool for a machine tool
Interchangeable tools for machine tools are classified in heading 84.66.
If the wheel is a complete grinding wheel of agglomerated abrasives
Grinding wheels of agglomerated abrasives are classified in Chapter 68, excluded from Chapter 84.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the wheel is classified as a part of wafer grinding machinery, not as a tool of Chapter 82
• Provide a statement of use to the CBSA to confirm the wheel is for semiconductor wafer thinning
• Check if the MFN duty rate or a preferential rate under a trade agreement applies
Related Products under Tariff item 8451.90.90
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