Wafer Lapping Machine Polishing Pad
A polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication, designed for chemical-mechanical planarization compatibility. This is a part of wafer preparation equipment, classified under parts of machinery for preparing printing components.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the pad is presented as a sheet of polyurethane not identifiable as a machine part.
Heading 39.20 covers plates, sheets, and film of plastics, which may apply if the pad is not specific to printing machinery.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Declare the polishing pad as a part of lapping machinery, not as a general plastic article
• Provide specifications on pad hardness and porosity to support classification
• Verify if the pad qualifies for duty-free entry under any trade agreements
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