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Parts of the foregoing machinery, apparatus or equipment

Machinery, apparatus and equipment (other than the machines of headings 84.56 to 84.65) for preparing or making plates, cylinders or other printing components; plates cylinders and other printing components; plates, cylinders and lithographic stones, prepared for printing purposes (for example, planed, grained or polished). > Parts of the foregoing machinery, apparatus or equipment > Parts of the foregoing machinery, apparatus or equipment

Duty Rate (from China)

0%
MFN TariffFree
Total Effective Rate0%

Products classified under Tariff item 8442.40

8442.40.00

Boule Grinder Workhead Assembly

A complete workhead assembly for a boule grinder, including motor, spindle, and stroke mechanism, used to advance crystal boules against grinding wheels with micron-level diameter control. This is a major replacement part for semiconductor grinders that prepare silicon boules for wafer slicing, falling under parts of machinery for preparing printing components by analogy to precision shaping equipment.

8442.40.00

Crystal Boule Grinder Spindle Assembly

A high-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats, featuring air bearings for vibration-free operation. This is a replacement part for grinding machinery used in preparing semiconductor materials, classified under parts of machinery for preparing printing components due to its precision shaping function.

8442.40.00

Crystal Puller Seed Holder Chuck

A graphite or quartz seed holder chuck that precisely positions a seed crystal during Czochralski crystal growth, critical for consistent boule diameter control. This is a part of crystal growing equipment used to produce semiconductor boules, classified under parts of machinery for preparing printing components by analogy to precision positioning apparatus.

8442.40.00

Crystal Puller Vacuum Chamber Lid

A stainless steel vacuum chamber lid with viewport and ports for Czochralski crystal pullers, maintaining an argon atmosphere during growth with a double O-ring seal design. This is a structural part of crystal growing equipment used in semiconductor boule production, classified under parts of machinery for preparing printing components.

8442.40.00

Czochralski Crystal Puller Replacement Heating Element

A graphite or molybdenum heating element that is a critical replacement part for Czochralski crystal pullers, providing precise temperature control during semiconductor boule growth. This is a part of crystal growing equipment used to produce silicon ingots, classified under parts of machinery for preparing printing components.

8442.40.00

Float Zone Crystal Grower RF Heating Coil

A radio frequency induction coil for float zone crystal growers that produce ultra-pure silicon ingots without crucibles, enabling zone refining for high-resistivity wafers. This is a part of semiconductor crystal growing equipment, classified under parts of machinery for preparing printing components.

8442.40.00

Semiconductor Crystal Grinder Diamond Dresser

A single-crystal diamond dresser tool for truing and dressing grinding wheels in semiconductor boule grinders, ensuring consistent wheel profile for precise flat grinding. This is a replacement part for wafer preparation grinders, classified under parts of machinery for preparing printing components.

8442.40.00

Semiconductor Wafer Polisher Head Assembly

A complete polishing head assembly with carrier film, retaining ring, and drive shaft for single or dual wafer polishers, applying 2-7 psi pressure for planarization. This is a major replacement part for wafer polishers used in semiconductor preparation, classified under parts of machinery for preparing printing components.

8442.40.00

Semiconductor Wafer Slicing Diamond Saw Blade

A precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication, ensuring minimal kerf loss and high surface quality. This is a replacement part for wafer slicing saws, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Edge Grinder Profiling Wheel

A resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing, with specific profiles for 200mm and 300mm wafers. This is a part of wafer grinder equipment used in semiconductor preparation, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Grinder Air Bearing Chuck

A porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination, maintaining wafer flatness within 0.1 microns. This is an essential part of wafer grinder or polisher equipment, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Grinder Vibration Isolation Mounts

Active pneumatic isolation mounts that reduce vibration transmission to less than 1 nm RMS for ultra-precision wafer grinding, critical for maintaining wafer bow specifications. These are parts of wafer grinder apparatus, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Lapping Machine Polishing Pad

A polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication, designed for chemical-mechanical planarization compatibility. This is a part of wafer preparation equipment, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Polishing Slurry Feed Nozzle

A sapphire or ceramic nozzle assembly that precisely delivers polishing slurry to wafer surfaces during CMP preparation, controlling flow rate for uniform material removal. This is a part of wafer polishing equipment, classified under parts of machinery for preparing printing components.

8442.40.00

Wafer Slicing Saw Coolant Nozzle Array

A multi-nozzle coolant delivery system for wire or blade wafer saws, maintaining blade temperature below 40°C during silicon slicing to prevent thermal damage to wafers. This is a part of wafer slicing saws, classified under parts of machinery for preparing printing components.