Wafer Lapping Machine Platen from Mexico
>- A cast iron or composite platen for lapping semiconductor wafers to precise flatness before polishing. It is a part of wafer grinder, lapper, or polisher under heading 8428 for semiconductor processing, providing the flat surface needed for material removal. This part falls under tariff item 8431.39.00 as an 'other' part of such machinery.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• >- Confirm the platen is solely for use with heading 8428 machinery to support classification
• Provide technical specifications showing its role in the lapping process
• Check if the platen is eligible for duty relief under the Machinery Remission Program