Other
Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines. > Of machinery of heading 84.28: > Other
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8431.39.00
Boule Handling Robot End-Effector
A boule handling robot end-effector is a specialized vacuum or gripper attachment designed to safely lift and transport heavy semiconductor crystal boules between processing stations. It is a part principally used with machinery of heading 84.28, such as robotic handling systems in wafer manufacturing equipment, and falls under tariff item 8431.39.00 as 'other' parts.
Crystal Boule Grinder
A crystal boule grinder is a precision machine used to shape semiconductor crystal boules to exact diameters and grind flats for conductivity type identification. It is a part of wafer preparation equipment under heading 84.28, and as a part of such machinery, it is classified under tariff item 8431.39.00 as 'other' parts.
Crystal Growth Crucible Holder
A crystal growth crucible holder is a high-purity graphite or quartz component that precisely positions the crucible in Czochralski furnaces during silicon pulling. It is an essential part of crystal grower machines classified under heading 84.28, and therefore falls under tariff item 8431.39.00 as 'other' parts.
Crystal Ingot Alignment Fixture
A crystal ingot alignment fixture is a precision device that aligns semiconductor ingots before grinding or slicing operations. It is designed solely for wafer preparation machinery of heading 84.28, and as a part of such machinery, it is classified under tariff item 8431.39.00 as 'other' parts.
Czochralski Crystal Puller Furnace
A Czochralski crystal puller furnace is a high-temperature furnace used to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower equipment classified under heading 84.28 for other machinery, and therefore falls under tariff item 8431.39.00 as 'other' parts.
Diamond Slurry Distribution Manifold
A diamond slurry distribution manifold evenly distributes diamond slurry across wafer lapping and polishing platens in semiconductor preparation equipment. It is a specific part for machinery of heading 84.28, and is classified under tariff item 8431.39.00 as 'other' parts.
Float Zone Crystal Grower
A float zone crystal grower is an apparatus that uses the float zone method to produce ultra-pure monocrystalline semiconductor boules by melting and recrystallizing silicon rods. It is classified as machinery of heading 84.28 for semiconductor material processing, and its parts fall under tariff item 8431.39.00 as 'other' parts.
RF Coil Assembly for Float Zone Puller
An RF coil assembly for a float zone puller is a radio frequency induction coil that creates the molten zone in float zone crystal growth systems. It is a specific part for heading 84.28 semiconductor machinery, and is included under tariff item 8431.39.00 as 'other' parts.
Seed Crystal Rotation Mechanism
A seed crystal rotation mechanism is a motorized device that rotates the seed crystal at precise speeds during Czochralski pulling to ensure uniform boule diameter. It is a critical part for heading 84.28 crystal growers, and is classified under tariff item 8431.39.00 as 'other' parts.
Semiconductor Wafer Slicing Diamond Saw
A semiconductor wafer slicing diamond saw is a diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. It is essential wafer preparation machinery of heading 84.28, and its parts are classified as 'other' under tariff item 8431.39.00.
Single-Side Wafer Polisher Head
A single-side wafer polisher head is a carrier head assembly that holds and polishes one side of semiconductor wafers to a mirror finish for device fabrication. It is a part of wafer polishing equipment in heading 84.28, and falls under tariff item 8431.39.00 for 'other' such parts.
Wafer Bow Measurement Fixture
A wafer bow measurement fixture holds wafers during bow and warp measurement in grinding process control stations. It is designed for wafer grinder and polisher equipment of heading 84.28, and its parts are classified under tariff item 8431.39.00 as 'other' parts.
Wafer Edge Profiling Tool
A wafer edge profiling tool is tooling for grinding precise edge profiles on semiconductor wafers to prevent chipping during handling. It is a part of wafer grinding equipment under heading 84.28, and is covered by tariff item 8431.39.00 as 'other' parts.
Wafer Lapping Machine Platen
A wafer lapping machine platen is a cast iron or composite platen used for lapping semiconductor wafers to precise flatness before polishing. It is a part of wafer grinder, lapper, or polisher equipment under heading 84.28 for semiconductor processing, and is classified in tariff item 8431.39.00 as 'other' parts.
Wafer Thickness Control Gauge Mount
A wafer thickness control gauge mount is a mounting fixture that positions in-process thickness gauges on wafer grinders for real-time feedback control. It is a part of semiconductor wafer preparation machinery of heading 84.28, and is classified under tariff item 8431.39.00 as 'other' parts.