Wafer Lapping Machine Platen from Japan
A wafer lapping machine platen is a cast iron or composite platen used for lapping semiconductor wafers to precise flatness before polishing. It is a part of wafer grinder, lapper, or polisher equipment under heading 84.28 for semiconductor processing, and is classified in tariff item 8431.39.00 as 'other' parts.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the platen is classified as a part of a lapping machine of heading 84.28, not as a standalone article
• Provide material specifications and dimensions to the CBSA
• Check if the platen qualifies for the Machinery Remission Program